IBM Systems Magazine, Mainframe Edition - March/April 2012 - (Page 40)

Tech Corner Programming, systems operations and more Fantastic Four Processor design innovations empower the z196 By Charles Webb BM System z* mainframes feature an impressive collection of technologies, including those supporting large databases, clustering, OSs, hypervisors and I/O. Together, these technologies enable continuously available, secure, high-volume transactions and queries against massive collections of information spread across multiple sites with diverse workloads. But that’s not all—the mainframe does more. Along with sharing hardware systems efficiently and reliably according to policies that respond to changing circumstances, it supports access to storage and networks with unmatched bandwidth, connectivity, reliability, and versatility. Processor technologies provide the engines to make this all work, executing billions of instructions per second with the mean time between failures measured in decades. Underneath is another layer of technology invisible to users, IT architects and programmers, providing the hardware’s fundamental building blocks. IBM’s vertical integration with research, development and production, spanning everything from silicon to systems, yields innovative solutions to fundamental technical challenges. Let’s examine a few of these solutions and how they contribute to the capabilities of the zEnterprise* 196 (z196) processor. I 1 Silicon Process The IT industry is built on the bedrock of the silicon integrated circuit. Advances are well known but still astounding. IBM has invested billions of dollars over the years to remain at the forefront of this field. The z196 processors are built using a 45 nm process. Some chip features are as small as 1/10,000th the diameter of a human hair. This provides a rich menu of devices for chip designers, allowing precise tradeoffs that enable them to get the most out of available chip area and power. IBM pioneered the use of silicon-on-insulator (SOI) wafers for chip manufacturing, with its thin insulating layer of silicon dioxide atop the silicon wafer to reduce parasitic capacitance. Such capacitance acts like a sponge, slowing signals, 40 22 MARCH/APRIL 2012

Table of Contents for the Digital Edition of IBM Systems Magazine, Mainframe Edition - March/April 2012

IBM Systems Magazine, Mainframe Edition - March/April 2012
Table of Contents
Editor’s Desk: Rethinking System z
IBM Perspective: Smarter Computing, Enterprise Modernization and the Mainframe
Insider: Proper Tools Can Bring Flexibility to Application Development
IT Today: Six Things You Didn't Know About the Modern Mainframe
Trends: Seven Reasons IT Projects Fail
Cover Story: Agile Thinking: How to leverage existing technology to gain a competitive advantage
Features: All Together Now: A centralized business analytics environment delivers great value
Improving Upon the Gold Standard: System z pushes the limits of high availability
Tech Corner: Processor Design Innovations Empower the z196
Developer: Accurate Project Scoping Helps Map Out a Faster Route to Success
Solutions/Advertiser's Index: PASSPORT Host Integration Objects - LegaSuite 6
Stop Run: Mainframer Clarence Golson Reflects on a Diverse Career Built on a Single Platform

IBM Systems Magazine, Mainframe Edition - March/April 2012